Accessories

Upgraded K1170

Product details

Technical Specifications

Main Control Module (1)CPU: Intel® Xeon®Silver Ice Lake-SP 4310 Processor (2)Memory: DDR4-2667; (3)Hard drive: 500G HDD; (4)Graphics card: integrated; (5)NIC: Intel® Ethernet X710-AT2 and I350-AM4 (6)Sound card: high-quality integrated sound card.

Object Display Booth (1)Camera pixels: 2 million pixels, HD IP camera; (2)Shooting range: 110cm*65cm; (3)Focusing mode: 18x optical zoom, autofocus.

External Camera (1)Camera pixels: 2 million pixels, HD IP camera; (2)Interface: HD-SDI; RJ-45; audio input/output; (3)Main stream ratio: 1920 x 1080, 1280 x 720, 1024 x 576; (4)Video codec standard: H.264/H.26/MJEPG; (5)Power: ≦ 3.5W; (6)Input voltage/current: DC 12V\1.0A.

Key features

Product features

Modular functional components that can be easily assembled and disassembled to simplify equipment upgrades and maintenance.

A tightly coupled modular circuit design makes the unit more stable.

A custom motherboard and OPS control cables make the unit more compact, lighter, safer, and easier to install and deploy.

Software redesigned with standardized functional interfaces is easier to use.

Smart integration with high cost-performance

Easy-to-use intelligent operations

Professional and convenient intelligent maintenance

Convenient for subsequent users to upgrade

Specifications

See the manufacturer description and linked documentation for product information. No specification table is published on the captured product webpage.

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